2 Layer Flexible Printed Circuit Board For Medical Monitors

Flexible base dielectric material such as polyimide forming the core.
Copper foil conductors patterned on the top, bottom and two inner layers of the core.
Cover layers laminated above and below for insulation, abrasion resistance and stiffness.
Plated through holes (PTH) and buried vias for vertical interconnections.
Edge contacts or stiffeners to provide external connections.

This construction provides the highest routing density on a flex PCB with fine conductors and clearances.

The ultra-dense interconnect capabilities of 4 layer FPCs supports the complex, compact and lightweight

Maximum routing density – Complex, compact layouts with traces on 4 layers.
Embedded discrete passives – Buried resistor, capacitor and inductor integration.
Controlled impedances – Tight impedance control for matched high speed signals.
Integrated shielding – Entire layers can provide EMI/RFI isolation.
Higher component density – More components in a given area with multilayer escape routing.
Multilayer stacking – Can integrate other flex or rigid-flex layers.
Greater functionality – High density interconnects enable more capabilities and features.
Miniaturization – Ideal for complex circuits in small, lightweight products.
Lower assembly costs – Eliminates separate flexible cabling and connectors.
High frequency performance – Controlled impedances benefit RF applications.