English
中文High frequency boards and high-speed boards have different definitions and characteristics.
High frequency boards are commonly used in electronic products, such as radio communications, radar, satellite communications, and other fields. They are required in applications where the operating frequency exceeds 500MHz.
High-frequency boards are known for their excellent transmission performance in high-frequency environments. They have a thinner board thickness, and finer line width and line spacing than ordinary PCB circuit boards. Additionally, the dielectric constant of high-frequency boards is particularly small, which reduces signal loss and improves signal transmission rate and reception sensitivity. High-frequency boards typically use materials such as RO4350B, RO4003C, and F4B.
High-speed boards are commonly used in computer motherboards, industrial control machines, and measurement and control instruments. In comparison to high-frequency boards, high-speed boards involve lower modulation and demodulation frequencies but higher rates, typically at the Gbps level.
High-speed boards are characterised by better line length performance, signal integrity, and anti-jamming ability when transmitting high-speed digital signals. Additionally, high-speed boards typically have a thicker board thickness, which can effectively suppress EMI (electromagnetic interference). These boards often use materials such as FR4 and PI.
It is important to note the difference between high-frequency boards and high-speed boards.
Although both high-frequency boards and high-speed boards are used for signal transmission in PCB circuit boards, there are differences between the two in practical applications. Secondly, the line width and board thickness also differ between the two types of boards.
Firstly, high-frequency boards are used in frequency bands of over 500MHz, while high-speed boards are mainly used for transmitting digital signals with modulation and demodulation frequencies ranging from tens of MHz to GHz levels.
The high-frequency board requires the use of micro-fine lines, resulting in narrower line width and spacing, as well as a thinner board thickness compared to the high-speed board. It is recommended to increase the line width and spacing of the high-speed board while maintaining a longer line length, allowing for a slightly thicker board thickness. Additionally, the materials used for the two boards differ.
High-frequency boards often use materials that have a lower dielectric constant to reduce signal transmission loss, compared to high-speed boards. High-speed boards typically use better materials than general PCB circuit boards, such as FR4 high TG material.
Secondly, high-frequency boards are widely used in radio communications, radar, satellite communications and other fields.
They use microfine lines to reduce signal loss, improve transmission rate and reception sensitivity, and ensure signal transmission and reception accuracy in high-frequency environments. High-speed boards also have various application scenarios.
High-speed boards are commonly used in computer motherboards, industrial controllers, and measurement and control instruments due to their ability to transmit high-speed digital signals with better signal integrity and anti-interference capability.
While high-frequency boards and high-speed boards are both used for signal transmission on PCB circuit boards, they have distinct characteristics and application scenarios. When selecting and applying a PCB circuit board, it is important to consider specific needs and scenarios to ensure stable product performance and accurate signal transmission.
