English
中文1. Packaging materials
Common packaging materials include: plastic, ceramics, glass, metal, etc. Nowadays, plastic packaging is basically used. The history of packaging changes: TO->DIP->PLCC->QFP->BGA->CSP.
2. Packaging classification
1. According to the packaging form: ordinary dual in-line, ordinary single in-line, small double-row flat, small four-row flat, round metal, larger thick wax circuit, etc.
2. According to packaging volume: the largest is thick film circuit, followed by dual in-line, single in-line, metal package, dual-row flat, and four-row flat. The smallest is.
3.Packaging principle
1. DIP (dual in-line package)
DIP refers to an integrated circuit chip packaged in dual in-line form. Most small and medium-sized integrated circuits (ICs) use this package form, and the number of pins generally does not exceed 100. ICs in DIP packages have two rows of pins and need to be inserted into a chip socket with a DIP structure. Of course, it can also be directly inserted into a circuit board with the same number of soldering holes and geometric arrangement for soldering. DIP packaged chips should be particularly careful when plugging and unplugging them from the chip socket to avoid damaging the pins.
DIP packaging has the following characteristics:
It is suitable for through-hole welding on PCB (Printed Circuit Board) and is easy to operate; the ratio between chip area and package area is large, so the volume is also large; DIP is the most popular plug-in package, and its application range includes standard logic IC, Memory and microcomputer circuits, etc.
2. QFP/PFP type packaging
The distance between chip pins in QFP/PFP packaging is very small and the pins are very thin. Generally, large-scale or ultra-large integrated circuits adopt this packaging form. Chips packaged in this form must use SMD (surface mount device technology) to solder the chip to the motherboard. Chips installed using SMD do not need to be drilled on the motherboard. Generally, there are designed solder joints for corresponding pins on the surface of the motherboard. Align each pin of the chip with the corresponding solder point to achieve soldering to the motherboard.
QFP/PFP packaging has the following characteristics:
Suitable for SMD surface mounting technology to install wiring on PCB circuit boards; low cost, suitable for medium and low power consumption, suitable for high-frequency use; easy to operate, high reliability; small ratio between chip area and packaging area; mature For sealed-to-transfer type, traditional processing methods can be used. At present, QFP/PFP packaging is widely used, and many MCU manufacturers use this package for their A chips.
4. SO type packaging
SO type packages include: SOP (small outline package), TOSP (thin small outline package), SSOP (reduced SOP), VSOP (very small outline package), SOIC (small outline integrated circuit package) and other similar QFP forms The package is just a chip package with only pins on both sides. This type of package is one of the surface mount packages. The pins are led out from both sides of the package in an “L” shape.
Typical characteristics of SO packaging: There are many pins around the packaged chip. The packaging operation is convenient and the reliability is relatively high. It is one of the current mainstream packaging methods. It is currently used in some memory types of ICs.
5. Features of QFN packaging:
Surface mount package, leadless design; leadless pad design occupies a smaller PCB area; components are very thin (<1mm), which can meet applications with strict space requirements; very low impedance, self-inductance, can Meets high-speed or microwave applications; has excellent thermal performance, mainly because of the large-area heat dissipation pad on the bottom; is light-weight and suitable for portable applications.
Features of QFN packaging: small size, can be used in portable consumer electronics such as laptops, digital cameras, personal digital assistants (PDAs), mobile phones and MP3s. From a market perspective, QFN packaging has attracted more and more attention from users. Taking into account various factors such as cost and volume, QFN packaging will be a growth point in the next few years, and the development prospects are extremely optimistic.
Since there are many IC packaging types, it has little impact on R&D and testing. However, for mass production and programming in factories, the more IC packaging types there are, the more corresponding matching programming socket models will be selected; ZLG programmer, ten Specializing in the chip burning industry for many years, we can support and provide burning sockets for various package types of ICs for factory mass production.
Ucreate PCB China has focused on electronic product design and development, component placement and burning testing for more than 19 years. The main products it develops and produces include: handheld printers, power banks, industrial control development boards, medical equipment and other products, and provides various electronic products. The product features one-stop SMT patch, THT plug-in, conformal paint process and finished PCB products assembly processing, providing the best quality products and services for your electronic product needs.
