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Telecom Electronics PCB Prototype Assembly
| PCB Layer: | 2 L |
| Thickness: | 1.6mm |
| PCB Size: | 25*38mm |
| Min Size: | 0402 |
| Min Pitch: | 0.1mm |
| Application: | Telecom Electronics |
| Item | Speci. |
|---|---|
| PCB SMT Min thickness | T ＜ 0.1mm |
| PCB SMT Max thickness | T ＞4.5mm |
| PCB SMT Min Length | L ≥3 mm |
| PCB SMT Min Width | W ≥ 3mm |
| PCB SMT Max Length | L ＞ 1200mm |
| PCB SMT Max Width | W ＞ 500mm |
| Min panel size | 0.3mm*0.2mm |
| Max panel size | 200mm*125mm ＜ SMD |
| component thickness | 6.5mm ＜ T ≤ 15mm |
| Min pin space | 0.3mm ≤ Pitch ＜ 0.4mm |
| Min ball space | 0.3mm ≤ Pitch ＜ 0.5mm |
| PCB DIP Min thickness | T ＜ 0.8mm |
| PCB DIP Max thickness | T ＞ 2mm |
| PCB DIP Min Length | L ≥ 50mm |
| PCB DIP Min Width | W ≥ 30mm |
| PCB DIP Max Length | L ≥ 1200mm |
| PCB DIP Max Width | W ≥ 500mm |
| Inter package | Vacuum/Antistatic Bag |
| Outer package | Carton |
| SMT capacity | Four Million point/day |
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